IC Packaging
Innovation and precision across the board
Elevate your integrated circuit packaging with Hana MICRO, the experts in low to medium pin count IC solutions. Our extensive range of IC packaging options includes open cavity, surface-mount, through-hole, chip on flex circuit, stacked die, BGA, inline, WLCSP, and more. With cutting-edge manufacturing techniques like wire bonding, dicing, die bonding, gold ball bumping, and glop top coating, we ensure top-notch quality in every IC assembly.
At Hana MICRO, our experienced team goes beyond standard offerings by providing custom layouts for prototyping and full-turnkey IC packages. Rest assured, our assemblies undergo rigorous testing to guarantee reliability and peak performance in real-world applications. When it comes to integrated circuit packaging, trust HANA Technologies for innovation and precision across the board.
Proud to serve
Hana MICRO is serving the world’s leading industries globally for over 30 years. Are you next?
How can we help?
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