HANA offers low and high volume wafer processing. Our advanced production technologies streamline IC manufacturing processes resulting in reliable performance, maximum protection, and quick turnaround wafer packaging.
Substrates 150mm and 200mm (adding 300mm in 2021)
Squares or rounds
Silicon, Borosilicate, Ceramic, Sapphire, MEMs, LEDs
Cleaning and Inspection
Alignment Layer Deposition
Cassette to cassette transfer
Contact or non-contact substrate mounting