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Wafer Processing

Wafer-Level Packaging

HANA offers low and high volume wafer processing. Our advanced production technologies streamline IC manufacturing processes resulting in reliable performance, maximum protection, and quick turnaround wafer packaging.  

Substrates 150mm and 200mm (adding 300mm in 2021)

  • Squares or rounds

  • Silicon, Borosilicate, Ceramic, Sapphire, MEMs, LEDs

Cleaning and Inspection
Alignment Layer Deposition

  • Organic alignment

  • Inorganic alignment

Rubbing

  • Auto alignment

  • Cassette to cassette transfer

Wafer Assembly
Laser Marking
Dicing Process

  • Contact or non-contact substrate mounting

  • Cleaning